Advanced Certification in IC Packaging & Manufacturing

For over 16 years, Maven Silicon has worked closely with the semiconductor industry to shape job-ready engineering talent. As packaging becomes the most critical differentiator in modern chip design, we saw a clear need for a structured, practice-driven learning pathway in IC packaging. This program represents our commitment to creating engineers who are not just academically trained, but professionally prepared to contribute from their first day in the industry.

iHub IIT Roorkee is committed to advancing semiconductor education that aligns with national technology priorities. This collaboration integrates academic rigor with industrial practice, ensuring learners develop strong fundamentals while gaining exposure to modern packaging design tools and methodologies. The IIT campus immersion experience further strengthens this academic-industry bridge.

Advanced IC packaging requires a highly sophisticated design ecosystem, rigorous multi‐physics analysis and a deep expertise in signal and power integrity. Through this collaboration, Siemens EDA brings its industry‐proven Xpedition ICP platform and globally recognized certification pathways to learners. This initiative ensures that students and professionals train on the same cutting‐edge technologies trusted by leading semiconductor companies worldwide. We are privileged to help accelerate the development of Indiaʼs next generation of packaging and manufacturing engineering talent.

For over 16 years, Maven Silicon has worked closely with the semiconductor industry to shape job-ready engineering talent. As packaging becomes the most critical differentiator in modern chip design, we saw a clear need for a structured, practice-driven learning pathway in IC packaging. This program represents our commitment to creating engineers who are not just academically trained, but professionally prepared to contribute from their first day in the industry.

iHub IIT Roorkee is committed to advancing semiconductor education that aligns with national technology priorities. This collaboration integrates academic rigor with industrial practice, ensuring learners develop strong fundamentals while gaining exposure to modern packaging design tools and methodologies. The IIT campus immersion experience further strengthens this academic-industry bridge.

Advanced IC packaging requires a highly sophisticated design ecosystem, rigorous multi‐physics analysis and a deep expertise in signal and power integrity. Through this collaboration, Siemens EDA brings its industry‐proven Xpedition ICP platform and globally recognized certification pathways to learners. This initiative ensures that students and professionals train on the same cutting‐edge technologies trusted by leading semiconductor companies worldwide. We are privileged to help accelerate the development of Indiaʼs next generation of packaging and manufacturing engineering talent.